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My previous blog explained the computing architecture requirements for AI workloads. Now, I take a deep dive into the types of materials engineering breakthroughs needed to enable these new architectures.
Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.
The senior vice president of Applied Materials’ Semiconductor Products Group provides his views on changes taking shape in the semiconductor industry as a new era of computing emerges centered on artificial intelligence (AI).