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Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
Improving logic device power and performance as critical dimensions scale requires materials innovation at the lower level interconnects—and Integrated Materials Solutions can accelerate customer success.
New facility will offer the industry’s most advanced R&D environment for working with the extended semiconductor ecosystem to accelerate readiness of new materials, methods and devices for computing applications including Big Data and Artificial Intelligence.