Semiconductors

Metrology allows process engineers to see the results of process steps. Today, driving improvements in chip performance, power and area/cost (PPAC) requires novel architectures and exotic material stacks. This is introducing new sources of atomic-scale variation that can negatively impact chip performance and yield. It is becoming imperative to “watch” the deposition process as it occurs to control variability and deliver repeatable performance.

Strategic investments from corporate venture capital into AI companies have been increasing. Read my latest blog to find out what’s driving this trend and where the funding is being directed.

During his keynote at the AI Design Forum™, Applied Materials CEO Gary Dickerson showed the audience how AI represents the biggest opportunity and challenge of our lifetime.

Applied Materials experts will deliver two presentations focused on emerging memories: MRAM, PCRAM and ReRAM.

Silicon carbide is expected to play an important role in the future of electronics as it demonstrates great potential in power applications.

Leading technology CEOs and industry thought leaders from across the computing ecosystem convened in San Francisco earlier this week at the second AI Design Forum™ to discuss the future of computing—from materials to systems. What was made clear from the thought-provoking keynotes and many sideline discussions is that AI and Big Data create tremendous growth opportunities for the industry, but to realize their potential requires new levels of innovation.

Today, Applied Materials is introducing the most sophisticated chip-making systems the company has ever developed to enable high-volume production of MRAM, PCRAM and ReRAM.

Breakthroughs in metrology and process control are needed to achieve high-volume production of emerging memories based on novel materials.

The latest R&D advances discussed at the 11th annual International Memory Workshop show strong momentum for new memory technologies.