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The serial interaction between siloed parts of the industry that produced the computing eras of the past—mainframe/minicomputer, PC/Internet, mobile/social media—will not be sufficient to fuel the next era of computing. Instead, we need codesign from materials to systems to enable the AI Era.
The AI Era is fueling an explosion of data, while Moore’s Law is no longer the predictable engine of progress that it once was. With opportunities and challenges of this magnitude, we need to open the strategic planning lens and decide where we want to be in 2029.
Metrology allows process engineers to see the results of process steps. Today, driving improvements in chip performance, power and area/cost (PPAC) requires novel architectures and exotic material stacks. This is introducing new sources of atomic-scale variation that can negatively impact chip performance and yield. It is becoming imperative to “watch” the deposition process as it occurs to control variability and deliver repeatable performance.
Strategic investments from corporate venture capital into AI companies have been increasing. Read my latest blog to find out what’s driving this trend and where the funding is being directed.
During his keynote at the AI Design Forum™, Applied Materials CEO Gary Dickerson showed the audience how AI represents the biggest opportunity and challenge of our lifetime.
Leading technology CEOs and industry thought leaders from across the computing ecosystem convened in San Francisco earlier this week at the second AI Design Forum™ to discuss the future of computing—from materials to systems. What was made clear from the thought-provoking keynotes and many sideline discussions is that AI and Big Data create tremendous growth opportunities for the industry, but to realize their potential requires new levels of innovation.
Today, Applied Materials is introducing the most sophisticated chip-making systems the company has ever developed to enable high-volume production of MRAM, PCRAM and ReRAM.
