Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
Looking at what to expect for the industry in 2019, the pace of change fueling a new computing revolution will accelerate, creating new challenges and tremendous opportunities for innovation.
I recently moderated a panel featuring some of the best minds in the industry predicting what the future of technology will look like and what it will take to get there.
Improving logic device power and performance as critical dimensions scale requires materials innovation at the lower level interconnects—and Integrated Materials Solutions can accelerate customer success.
