Semiconductors

Today, Applied Materials is introducing the most sophisticated chip-making systems the company has ever developed to enable high-volume production of MRAM, PCRAM and ReRAM.

Breakthroughs in metrology and process control are needed to achieve high-volume production of emerging memories based on novel materials.

The latest R&D advances discussed at the 11th annual International Memory Workshop show strong momentum for new memory technologies.

AI Design Forum™ returns to San Francisco to explore “The Future of Computing—from Materials to Systems.” The event will feature thought-provoking keynotes from the CEOs of AMD, Applied Materials, Synopsys and Xilinx; plus technology vision presentations from Arm, Google, Qualcomm and the Embedded Vision Alliance.

AI is being implemented at the edge, near-edge and cloud—and each application demands a unique set of memory requirements.

Back-scattered electron imaging technologies reveal buried defects to speed process development and improve chip performance and yield.

Solving the manufacturing challenges of next-generation memory technologies—where a few atoms can make a very big difference—will require expertise in materials engineering and manufacturing.

Selective removal technologies capable of removing materials at the atomic-scale are needed to enable new ways to shrink transistors as 2D scaling reaches physical limits.

Applied Materials is honored to be recognized among Intel’s 2018 Preferred Quality Supplier (PQS) award winners.