The Revolutionary Impact of 3D Chip Packaging

Personal mobile devices like smartphones, tablets and laptop PCs are rapidly evolving, becoming faster, smaller and functionally more sophisticated. To maintain this dramatic progress in device capability, the semiconductor industry is now at a new inflection point – the era of 3D chip packaging.

In this video, Applied’s Sesh Ramaswami discusses the fundamentals of advanced packaging and the revolutionary impact this technology is having on the gadgets we buy and the cloud infrastructure that makes mobility work.

Not entirely coincidentally, the opening of the new Center of Excellence in Advanced Packaging in Singapore was announced today. Applied Materials and Singapore’s Institute of Microelectronics (IME), opened this first of its kind R&D facility to accelerate the development of 3D chip packaging.

Read the press release to learn more or watch this upbeat video.

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