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Nirmalya Maity, Ph.D.
Nirmalya Maity is corporate vice president of Advanced Packaging at Applied Materials. Previously, he was at Cabot Corporation where he held several key leadership positions including Chief Technology Officer and vice president of Corporate Strategy & Development. Prior to Cabot, Nirmalya worked for Applied Materials in various technology and product management leadership roles. He received his Ph.D. in chemical engineering from Cornell University and bachelor of science in chemical engineering from the Indian Institute of Technology, Roorkee.
Applied Materials recently entered a new phase of our R&D collaboration with A*STAR’s Institute of Microelectronics to accelerate materials, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.
Applied’s upcoming, Sept. 8 Master Class features the topic of heterogeneous design and advanced packaging. In this blog I preview why the role of packaging has evolved from simply protecting and connecting chips to circuit boards, to now being a competitive imperative for the world’s leading semiconductor and systems companies.