Emerging Technologies

Introducing Breakthroughs in Materials Engineering for DRAM Scaling

To help the industry meet global demand for more affordable, high-performance memory, Applied Materials today introduced solutions that support three levers of DRAM scaling: a new hard mask material for capacitor scaling, a low-k dielectric material for the interconnect wiring, and the adoption of high-k metal gate transistors for advanced DRAM designs.

DRAM Scaling Requires New Materials Engineering Solutions

The AI Era of computing is fueling exponential growth in data generation, and the entire technology ecosystem depends on the semiconductor industry finding new ways to scale DRAM architectures to keep pace with bit demand. New hard mask patterning films can enable thinner capacitors with the highest possible aspect ratios, while new dielectric insulating materials can reduce the spacing between metal lines, both resulting in new ways to shrink.

Trends Accelerating the Semiconductor Industry in 2021 and Beyond

2020 will be remembered most for the challenges of COVID-19. In the world of technology, it will be remembered for accelerating digital transformations that would have taken many more years to play out. Entering 2021, the dependency between the global economy and semiconductors is greater than it’s ever been. At the same time, the way chips are being made is changing as traditional Moore’s Law scaling slows. Applied Materials is dedicated to driving new ways to help our customers continue to deliver improvements in chip power, performance and cost, in record time.