Electrochemical Deposition: Copper Wiring for Next-Generation Chips

Applied Materials’ Bob Linke, process integration manager, Semitool Business Unit, discusses the Applied Raider GT electrochemical deposition (ECD) system – a significant innovation for fabricating copper interconnects at the 22nm technology node and beyond.

For more technical information on the Raider GT system and Applied's other new technologies for advanced chipmaking, visit www.becauseinnovationmatters.com.

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