Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.
Zhebo Chen
Zhebo Chen is a global product manager in the Metal Deposition Products group at Applied Materials. He joined Applied in 2016 and holds a bachelor’s degree in chemical engineering from the University of Illinois at Urbana-Champaign and a Ph.D. in chemical engineering from Stanford University.
Selective processing is increasingly being used to create, shape and modify materials and features in semiconductor manufacturing. In this blog I explain what selective processing is and why it’s critically important to the future of chip scaling.
Applied’s newest Integrated Materials Solution solves the challenge of selective tungsten deposition, enabling simultaneous improvements in chip power, performance and area/cost (PPAC) in the most advanced foundry-logic nodes.
With EUV-enabled advances in 2D scaling pushing the limits of conventional materials engineering techniques, a breakthrough is needed to overcome increases in contact resistance and enable continued improvements in chip performance, power and area/cost (PPAC).
The advent of EUV lithography is helping overcome transistor scaling challenges, but new innovations in materials engineering are needed to enable performance and power to scale as well.
