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Zhebo Chen
Zhebo Chen is a global product manager in the Metal Deposition Products group at Applied Materials. He joined Applied in 2016 and holds a bachelor’s degree in chemical engineering from the University of Illinois at Urbana-Champaign and a Ph.D. in chemical engineering from Stanford University.
Applied’s newest Integrated Materials Solution solves the challenge of selective tungsten deposition, enabling simultaneous improvements in chip power, performance and area/cost (PPAC) in the most advanced foundry-logic nodes.
With EUV-enabled advances in 2D scaling pushing the limits of conventional materials engineering techniques, a breakthrough is needed to overcome increases in contact resistance and enable continued improvements in chip performance, power and area/cost (PPAC).
The advent of EUV lithography is helping overcome transistor scaling challenges, but new innovations in materials engineering are needed to enable performance and power to scale as well.
