Uday Mitra, Ph.D.

Dr. Mitra is a Vice President of Engineering at Applied Materials. He has nearly 4 decades of experience in the semiconductor industry managing technology integration, lithography, etch, thin films and packaging modules for both logic and memory products. Prior to joining Applied in 2005, he was director of technology integration at Intel Corporation, where he spent 17 years holding various management positions. Uday received his Ph.D. in materials science from MIT and is a recipient of the Henry Marion Howe Medal from the American Society of Materials International.

Newer Ways to Shrink

The industry will continue to use EUV lithography and materials engineering to push logic density scaling to the limit. In recent years, DTCO techniques have supplemented classic 2D scaling, and today, these “newer ways to shrink” contribute about half of the industry’s progress.