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Maayan Bar-Zvi manages the Patterning Division of Applied Materials’ Process Diagnostics and Control (PDC) group, including eBeam metrology and next-generation process control products and solutions. He has held several leadership positions during his 18 years with the PDC group, including Application Technology Manager, Product Manager and Product Line Head. Maayan earned a B.S. in engineering from Tel-Aviv University.
As the semiconductor industry increasingly moves from simple 2D chip designs to complex 3D designs based on multipatterning and EUV, patterning control has reached an inflection point. The optical overlay tools and techniques the semiconductor industry traditionally used to reduce errors are simply not precise enough for today’s leading-edge logic and memory chips.