Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.
Dr. Isaac Ow
Dr. Isaac Ow serves as global product manager in the Metal Deposition Products (MDP) Group at Applied Materials, managing PVD products and solutions for UBM/RDL and TSV CuBS applications. He obtained a doctorate in physics from the National University of Singapore, has authored numerous scientific publications, and has many years of packaging experience ranging from sales and marketing to process/industrial engineering. Besides product management and marketing, Dr. Ow is working on R&D projects in the lab with MDP’s packaging team at the Asia Product Development Center, Applied’s Advance Packaging R&D facility in Singapore.
Applied Materials’ Endura Ventura PVD, the first metallization solution for high-volume manufacturing of high aspect ratio through-silicon via structures enables the smaller, lower power, high-performance integrated 3D chips required for high-end electronic devices.
