WLP

Advanced packaging can meet performance, power and density requirements for a range of More-than-Moore device types.

New flexible system delivers best-in-class performance and productivity for the full range of plating steps used in diverse advanced packaging schemes.

Proliferating mobile, “smart” electronic consumer products, Internet of Things devices, and high-performance computing applications are driving greater complexity in wafer-level packaging schemes and expanding the number of electrochemical deposition steps in their fabrication.

Innovations in software automation increase manufacturing flexibility, efficiency and quality to meet customer requirements for complex packaging designs.