through-silicon vias

3D Chip Technology for Dummies

3D Chip Technology for Dummies

It's not just movies, televisions and video games that are going three-dimensional these days. Microchips are doing it, too.Semiconductors aren't shifting into the third dimension because it’s fashionable, though. This shift is about continuing Moore’s Law, the relentless drive for higher performance that has driven the industry for four decades.With three very different types of 3D construction in development today, it can be a confusing subject. Vertical chip structures, 3D device stacking, 3D chip packaging – what does it all mean?We made this video to help demystify the subject. Did it help? Let me know in the comments below. 
Applied Materials

Opportunities in Through-Silicon Via Technology for 3D Packaging

The industry has reached a crucial inflection point on the adoption and commercialization of 3D packaging technology, and Applied Materials’ CTO Hans Stork gave attendees of the 3D Architectures for Semiconductor Integration and Packaging conference held recently in Burlingame, Calif. his assessment on the current status of this emerging technology.According to Stork, though significant challenges remain with vertical interconnects using through-silicon vias (TSVs), the semiconductor industry is on the verge of turning this into a manufacturing technology.