Process Control

sparse sampling on a wafer

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

The patterning challenges of today’s most advanced logic and memory chips can be solved with a new playbook that takes the industry from optical target-based approximation to actual, on-device measurements; limited statistical sampling to massive, across-wafer sampling; and single-layer patterning control to integrative multi-layer control. Applied’s new PROVision® 3E system is designed to enable this new playbook.

Breakthrough in Metrology Needed for Patterning Advanced Logic and Memory Chips

As the semiconductor industry increasingly moves from simple 2D chip designs to complex 3D designs based on multipatterning and EUV, patterning control has reached an inflection point. The optical overlay tools and techniques the semiconductor industry traditionally used to reduce errors are simply not precise enough for today’s leading-edge logic and memory chips.

Introducing a New Playbook in Process Control

Applied Materials is reinventing process control with a new solution, unveiled today, that uses Big Data and AI to find yield-killing defects better, faster and more cost effectively than legacy approaches. The solution allows chipmakers to accelerate yields and time to market of semiconductor process technologies and fabs. 
Lithography Celebrates 25 Years on the Cutting Edge

Lithography Celebrates 25 Years on the Cutting Edge

Applied Materials recently hosted a panel discussion with several distinguished semiconductor industry speakers as part of the SPIE Advanced Lithography conference earlier this month, which I had the honor of moderating. The panel discussion, a retrospective look at the 25 years of technology developments in metrology, inspection and process control was co-hosted by Chris Raymond, technology director at Nanometrics, Inc. and Chair of the SPIE Conference.
25 Years of Industry Innovation in Metrology, Inspection & Process Control

25 Years of Industry Innovation in Metrology, Inspection & Process Control

Applied Materials is sponsoring an interactive panel discussion celebrating 25 years of industry innovation in metrology, inspection, and process control at this year’s SPIE Advanced Lithography conference in San Jose, California.The event — a retrospective look at 25 years of technology developments — will gather speakers from top semiconductor manufacturers and lithography related industry, including ASML, Samsung and Mentor Graphics, in an informal exchange of opinions on what they view as key milestones in the evolution of lithography and what they foresee as major technology trends over the next few years.
LED Automation Software: Understanding the Process Through Data is an Important First Step

LED Automation Software: Understanding the Process Through Data is an Important First Step

Previously, I wrote about how LED manufacturers were striving to shorten the time between initiating the LED manufacturing process and measuring their performance in an effort to improve the product yields and possibly even boost LED performance.Certainly one of the keys to making this possible is having rapid access to manufacturing data. There are many ways to gather data for analysis by the process engineers.