Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
At this year’s SPIE symposium Applied Materials will present several technical papers focused on solving some of the industry’s toughest patterning challenges.
Patterning challenges for the semiconductor industry are growing as the number of multi-patterned layers being used in the 10nm and beyond nodes increase.
