lithography

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Chips

As classic 2D scaling with EUV shrinks on-chip wiring, electrical resistance increases exponentially, creating power, performance and heat challenges. Moreover, as transistor counts continue to increase exponentially while 2D scaling slows, die sizes are increasing to the point where designers are hitting the “reticle limit” of chip designs. Fortunately, innovations in chip wiring will enable chipmakers to continue delivering improvements in performance and power—while advances in chip integration will give designers virtually unlimited transistor budgets. In short, “new ways to wire and integrate chips” will enable amazing computing experiences for everyone.
New Lithography Technologies Gain a Foothold

New Lithography Technologies Gain a Foothold

Historically, many of the developments in the semiconductor industry have stemmed from the continued progress in lithography. However, with the persistent uncertainty of extreme ultraviolet (EUV) for future-generation patterning, the industry has developed techniques such as self-alignment double patterning (SADP) to extend optical lithography. In a video produced by SPIETV, Chris Bencher of Applied Materials Office of the Chief Technology Officer, reviews the evolution of SADP and looks to its future. 
Applied Explains: Photomask Technology for the EUV Era

Applied Explains: Photomask Technology for the EUV Era

Photomasks, as regular readers of this blog may recall, are the blueprints used for making chips. The photolithography process prints the patterns etched on the mask onto silicon wafers to define transistors, memory cells and wiring – all the nanoscale structures that make up a functional device.Lithography is expected to undergo a seismic shift over the next few years as the industry adopts a new technology called extreme ultraviolet lithography, or EUV for short. This change requires a new generation of photomasks featuring new materials and operating principles.