gate-all-around

The industry will continue to use EUV lithography and materials engineering to push logic density scaling to the limit. In recent years, DTCO techniques have supplemented classic 2D scaling, and today, these “newer ways to shrink” contribute about half of the industry’s progress.

Selective processing is increasingly being used to create, shape and modify materials and features in semiconductor manufacturing. In this blog I explain what selective processing is and why it’s critically important to the future of chip scaling.