GAA

Newer Ways to Shrink

The industry will continue to use EUV lithography and materials engineering to push logic density scaling to the limit. In recent years, DTCO techniques have supplemented classic 2D scaling, and today, these “newer ways to shrink” contribute about half of the industry’s progress.
Applied Presents Cutting-Edge Research at IEDM 2017

Applied Presents Cutting-Edge Research at IEDM 2017

At the upcoming IEEE International Electron Devices Meeting (IEDM) to be held in San Francisco from December 2-6, Applied Materials technologists will be among the world’s foremost semiconductor industry experts gathered to present on the latest research breakthroughs. Applied will showcase how solutions in our R&D pipeline can enable multiple technology inflections shaping the future.