extreme ultraviolet lithography

Historically, many of the developments in the semiconductor industry have stemmed from the continued progress in lithography. However, with the persistent uncertainty of extreme ultraviolet (EUV) for future-generation patterning, the industry has developed techniques such as self-alignment double patterning (SADP) to extend optical lithography. In a video produced by SPIETV, Chris Bencher of Applied Materials Office of the Chief Technology Officer, reviews the evolution of SADP and looks to its future. 

Photomasks, as regular readers of this blog may recall, are the blueprints used for making chips. The photolithography process prints the patterns etched on the mask onto silicon wafers to define transistors, memory cells and wiring – all the nanoscale structures that make up a functional device.Lithography is expected to undergo a seismic shift over the next few years as the industry adopts a new technology called extreme ultraviolet lithography, or EUV for short. This change requires a new generation of photomasks featuring new materials and operating principles.