AI Era

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

At the Applied Materials Master Class today, we highlight two fast-growing and highly enabling areas of the semiconductor industry. “ICAPS” silicon powers billions of new devices on the edge—including electric vehicles. No longer an afterthought, packaging now enables the benefits associated with Moore’s Law to continue even as 2D scaling slows. Today’s class demonstrates that the AI Era requires innovation across a wide range of technologies, from the edge to the cloud.

Designing “Eyes” into Process Equipment to Improve Chip Performance and Yield

Metrology allows process engineers to see the results of process steps. Today, driving improvements in chip performance, power and area/cost (PPAC) requires novel architectures and exotic material stacks. This is introducing new sources of atomic-scale variation that can negatively impact chip performance and yield. It is becoming imperative to “watch” the deposition process as it occurs to control variability and deliver repeatable performance.