Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.
Upgrade your browser for full experience
You are using a web browser version that is no longer supported. Please make sure you are using the most updated version of your browser, or try using our supported browser Google Chrome to get the full Applied Materials experience.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.
The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.