3D NAND

Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.

Join Applied Materials and a panel of experts in San Francisco on Dec. 4 to explore the types of memories needed for artificial intelligence applications.

The final installment of my blog series discusses the need for “integrated materials systems” and why the days of working with individual materials from the periodic table are over.

Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.

Scaling and emerging applications are driving market and technology changes.

Applied Materials reports on recent R&D achievements for manufacturing 3D transistors and new memory technologies.

The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.

3D NAND is getting closer to becoming a mainstream technology. However, there is still work to be done for it to make its way into the cost-sensitive consumer market.

What are some of the innovations behind Moore’s Law? As technology advancement continues full steam ahead, Applied Materials recognizes and celebrates Moore’s Law on its 50th anniversary.