Personal mobile devices like smartphones, tablets and laptop PCs are rapidly evolving, becoming faster, smaller and functionally more sophisticated. To maintain this dramatic progress in device capability, the semiconductor industry is now at a new inflection point – the era of 3D chip packaging.In this video, Applied’s Sesh Ramaswami discusses the fundamentals of advanced packaging and the revolutionary impact this technology is having on the gadgets we buy and the cloud infrastructure that makes mobility work.