Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

At this year's SEMICON West 2010, Applied Materials introduced the Producer Avila system, the latest innovation for TSV production. Sesh Ramaswami, Senior Director, Through-Silicon Via Program discusses how Applied Materials is leading the next technology inflection to advance Through-Silicon Via (SV) technology for high-volume manufacturing.

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