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While transistor performance improves with scaling, the same cannot be said for interconnects. In fact, interconnect resistance increases as we move to smaller process nodes, which compromises device performance and power consumption. To continue scaling interconnects in advanced logic requires innovations in materials engineering.
At our upcoming Logic Master Class, experts from Applied and the industry will shed light on the innovations needed to enable advanced logic to further scale and deliver improvements in PPACt. In this blog I give a preview of what we’ll be discussing related to transistor design and scaling challenges.
We are at the beginning of a new technological era for the field of optics. To accelerate the commercialization of Flat Optics, a larger collaborative effort is needed to scale the technology and deliver its full benefits to a wide range of applications.
Looking at what to expect for the industry in 2019, the pace of change fueling a new computing revolution will accelerate, creating new challenges and tremendous opportunities for innovation.
I recently moderated a panel featuring some of the best minds in the industry predicting what the future of technology will look like and what it will take to get there.
Improving logic device power and performance as critical dimensions scale requires materials innovation at the lower level interconnects—and Integrated Materials Solutions can accelerate customer success.
As we head into the holidays and count down the final days to a new year, we enter a fun and rewarding season of giving at Applied Materials where employees connect with community issues and come together to help those in need.
Join Applied Materials and a panel of experts in San Francisco on Dec. 4 to explore the types of memories needed for artificial intelligence applications.
Author and environmental advocate Paul Hawken was honored with the 2018 James C. Morgan Global Humanitarian Award and five innovators were recognized for using technology to benefit humanity at the annual Tech for Global Good Celebration.
New facility will offer the industry’s most advanced R&D environment for working with the extended semiconductor ecosystem to accelerate readiness of new materials, methods and devices for computing applications including Big Data and Artificial Intelligence.
Applied Materials and National University of Singapore jointly open a new R&D lab with support of the National Research Foundation Singapore. The goal of the collaboration is to accelerate the discovery and commercialization of new materials for manufacturing next-generation semiconductors.
