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Make Possible

Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.

Corporate Responsibility

Making the Grade in ESG

by Chris Librie
Feb 23, 2021
While Applied Materials’ ESG ratings are improving, we’re not satisfied yet. Our aspiration is to help drive the semiconductor industry into a leadership role on climate change and supplier engagement.
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Corporate Responsibility

A Sustainability Discussion with Computing Industry Leaders: Seizing the Opportunity for Innovation

by Chris Librie
Feb 04, 2021
Recently I participated in an engaging panel discussion on the topic of “Driving Decarbonization in Turbulent Times and Beyond.” What was clear from the discussion is that many businesses are innovating to improve not only their footprint but those of their value chain—suppliers and customers, and that these efforts present tech companies with opportunities for innovation and differentiation.
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Corporate Responsibility

A Virtual Fight Against Actual Hunger Nets $4M for Food Banks

by Siobhan Kenney
Feb 02, 2021
Applied Materials employees responded generously during our annual North America Fight Against Hunger—a month-long campaign, held virtually this year, to raise funds to help alleviate hunger in communities where we work and live.
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Enabling the AI Era with a New Integrated Materials Solution
Semiconductors

Enabling the AI Era with a New Integrated Materials Solution

by Jonathan Bakke
Jul 19, 2018
The Applied Materials platforms that create our Integrated Materials Solution for cobalt have been industry workhorses for several decades, and the innovations being developed show they remain critical for the dimensional and materials scaling necessary to continue improving the power, performance and area/cost (PPAC) of chips.
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Semiconductors

Celebrating the Producer Platform’s 20 Years of Innovation

by Applied Materials Blog
Jul 09, 2018
New materials and integrated process approaches offered on the Producer platform will help to enable future semiconductor designs.
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Semiconductors

Why Materials Engineering Breakthroughs are Required for New AI Computing Architectures

by Sundeep Bajikar
Jun 30, 2018
My previous blog explained the computing architecture requirements for AI workloads. Now, I take a deep dive into the types of materials engineering breakthroughs needed to enable these new architectures.
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Semiconductors

Why AI Workloads Require New Computing Architectures – Part 1

by Sundeep Bajikar
Jun 20, 2018
This two-part blog series examines the changes needed to computing architectures in the AI era and the role materials engineering will play to make it happen.
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Enabling the AI Era with New Materials
Semiconductors

Enabling the AI Era with New Materials

by Jonathan Bakke
Jun 12, 2018
The first material change in the transistor contact and interconnect in 20 years is required to remove a major performance bottleneck between transistors and the outside world.
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Semiconductors

Final Industry Thoughts on Full-Nodes, Inter-Nodes, Leading-Nodes and Trailing-Nodes – Part 3

by Sundeep Bajikar
May 30, 2018
The final installment of my blog series discusses the need for “integrated materials systems” and why the days of working with individual materials from the periodic table are over.
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Semiconductors

Further Industry Thoughts on Full-Nodes, Inter-Nodes, Leading-Nodes and Trailing-Nodes – Part 2

by Sundeep Bajikar
May 29, 2018
Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.
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Industry Thoughts on Full-Nodes, Inter-Nodes, Leading-Nodes and Trailing-Nodes – Part 1
Semiconductors

Industry Thoughts on Full-Nodes, Inter-Nodes, Leading-Nodes and Trailing-Nodes – Part 1

by Sundeep Bajikar
May 23, 2018
Industry experts share their views on what’s needed to address challenges at leading-nodes and deliver innovation at inter-nodes and trailing-nodes.
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The Role of CMP in Device Scaling
Emerging Technologies
Semiconductors

The Role of CMP in Device Scaling

by Sameer Deshpande , Garlen Leung
May 18, 2018
CMP continues to be a key technology for materials-enabled scaling for the latest 3D inflections in NAND and logic, and will be critical to managing edge placement error.
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