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While transistor performance improves with scaling, the same cannot be said for interconnects. In fact, interconnect resistance increases as we move to smaller process nodes, which compromises device performance and power consumption. To continue scaling interconnects in advanced logic requires innovations in materials engineering.
At our upcoming Logic Master Class, experts from Applied and the industry will shed light on the innovations needed to enable advanced logic to further scale and deliver improvements in PPACt. In this blog I give a preview of what we’ll be discussing related to transistor design and scaling challenges.
We are at the beginning of a new technological era for the field of optics. To accelerate the commercialization of Flat Optics, a larger collaborative effort is needed to scale the technology and deliver its full benefits to a wide range of applications.
Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.