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Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.

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Semiconductors

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Chips

by Kevin Moraes
May 23, 2022
As classic 2D scaling with EUV shrinks on-chip wiring, electrical resistance increases exponentially, creating power, performance and heat challenges. Moreover, as transistor counts continue to increase exponentially while 2D scaling slows, die sizes are increasing to the point where designers are hitting the “reticle limit” of chip designs. Fortunately, innovations in chip wiring will enable chipmakers to continue delivering improvements in performance and power—while advances in chip integration will give designers virtually unlimited transistor budgets. In short, “new ways to wire and integrate chips” will enable amazing computing experiences for everyone.
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Semiconductors

Newer Ways to Shrink

by Uday Mitra, Ph.D.
Apr 19, 2022
The industry will continue to use EUV lithography and materials engineering to push logic density scaling to the limit. In recent years, DTCO techniques have supplemented classic 2D scaling, and today, these “newer ways to shrink” contribute about half of the industry’s progress.
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Semiconductors

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Metrology Breakthroughs

by Regina Freed
Apr 14, 2022
Classic 2D Moore’s Law scaling can continue for years into the future—as long as we also solve the materials engineering and metrology challenges that accompany EUV lithography.
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Emerging Technologies
Semiconductors

How New Materials and Memories Can Help the AI Ecosystem Bend the Climate Curve

by Ellie Yieh
Aug 19, 2020
Recently I participated in a fascinating panel discussion with experts from Arm, Google, Intel, Microsoft, UC Santa Barbara and VMware to explore how Big Data, AI and cloud computing can be used to help mitigate—rather than contribute to—climate change.
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Corporate
Corporate Responsibility
Semiconductors

Make Possible a Better Future

by Applied Materials Blog
Jul 21, 2020
Watch the video replay of Applied Materials CEO Gary Dickerson’s keynote at SEMICON West to hear about new initiatives Applied is driving to enable a more sustainable company, industry and world.
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Semiconductors

Introducing a Breakthrough in 2D Scaling

by Zhebo Chen
Jul 20, 2020
Applied’s newest Integrated Materials Solution solves the challenge of selective tungsten deposition, enabling simultaneous improvements in chip power, performance and area/cost (PPAC) in the most advanced foundry-logic nodes.
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Semiconductors

Solving Transistor Contact Resistance Requires Materials Engineering Innovations

by Zhebo Chen
Jul 16, 2020
With EUV-enabled advances in 2D scaling pushing the limits of conventional materials engineering techniques, a breakthrough is needed to overcome increases in contact resistance and enable continued improvements in chip performance, power and area/cost (PPAC).
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Semiconductors

Transistor Scaling Gated by Contact Resistance

by Zhebo Chen
Jul 08, 2020
The advent of EUV lithography is helping overcome transistor scaling challenges, but new innovations in materials engineering are needed to enable performance and power to scale as well.
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Corporate Responsibility

Thank You Teachers for Going Above and Beyond

by Heather LeCon
May 07, 2020
As we celebrate Teacher Appreciation Week, employees share stories about teachers who continue to make a lasting impact in their lives.
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Emerging Technologies

COVID-19: Applied Ventures’ Life Sciences Portfolio Companies Tap Materials Engineering to Fight the Deadly Virus

by Anand Kamannavar
May 04, 2020
Three of Applied Ventures’ investment companies are working tirelessly using materials engineering and imaging capabilities to develop innovations that can help the medical community detect, treat, curtail—and ultimately suppress—this viral pandemic.
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Semiconductors

Materials-Enabled Patterning Helps Eliminate Trade-Offs in PPAC

by Regina Freed
Apr 27, 2020
My latest blog describes three innovative patterning techniques that complement EUV and accelerate the industry’s roadmap for logic and DRAM scaling.
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Corporate Responsibility

Celebrating Earth Day!

by Heather LeCon
Apr 22, 2020
This year, Applied Materials employees are going virtual in support of EarthWorks, the company’s annual campaign to inspire education and action around environmental sustainability and ensure a cleaner and greener tomorrow.
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