Our blog is dedicated to a global discussion about the ideas, actions and technologies changing the world as we know it.
Upgrade your browser for full experience
You are using a web browser version that is no longer supported. Please make sure you are using the most updated version of your browser, or try using our supported browser Google Chrome to get the full Applied Materials experience.
At the Applied Materials Master Class today, we highlight two fast-growing and highly enabling areas of the semiconductor industry. “ICAPS” silicon powers billions of new devices on the edge—including electric vehicles. No longer an afterthought, packaging now enables the benefits associated with Moore’s Law to continue even as 2D scaling slows. Today’s class demonstrates that the AI Era requires innovation across a wide range of technologies, from the edge to the cloud.
Applied’s upcoming, Sept. 8 Master Class features the topic of heterogeneous design and advanced packaging. In this blog I preview why the role of packaging has evolved from simply protecting and connecting chips to circuit boards, to now being a competitive imperative for the world’s leading semiconductor and systems companies.
As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.
Our latest in a series of blogs inspired by Applied Materials’ panel discussion at IEDM explores where and how data should be processed and stored to drive computing efficiency while curbing energy consumption.
Applied Materials moderated a thought-provoking panel discussion during IEDM which showed that while there is no single path to achieving continued improvements in chip performance, power and area-cost, the industry will be well-served to search for solutions together.
What’s clear from the panel discussion I recently moderated with Facebook, IBM, Intel, Stanford and TSMC is that the semiconductor design and manufacturing model is evolving and will look extremely different in the years ahead.
This year’s Tech for Global Good Celebration honored four innovative organizations who are using technology to address critical problems facing our future, and recognized ocean conservationist and women in STEM advocate Julie Packard with the James C. Morgan Global Humanitarian Award.
Where can the industry test codesigned chip innovations for the AI Era—to accelerate the future of computing, from materials to systems? The answer is: our new Materials Engineering Technology Accelerator (META Center), which—I’m delighted to announce—is now open for collaboration.
