Applied’s upcoming, Sept. 8 Master Class features the topic of heterogeneous design and advanced packaging. In this blog I preview why the role of packaging has evolved from simply protecting and connecting chips to circuit boards, to now being a competitive imperative for the world’s leading semiconductor and systems companies.

As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.

As the 2021-22 school year begins, we are thankful for the dedication, passion and grit of education providers around the world.

Alliance for Global Inclusion aims to improve diversity and inclusion across industries with goals tied to representative leadership, inclusive product development and broader access to STEM education for underserved communities.

In this blog, I look at ways Applied Materials is working with leading customers who wish to sustainably increase production to meet the world’s growing need for semiconductors. About half of the opportunity lies in the sub-fab, the often-overlooked world of support equipment below the production floor that consumes around half of the energy needed by modern fabs.

Compound semiconductors like silicon carbide (SiC) signal a new era of materials engineering in the automotive semiconductor market, one that can significantly increase efficiency, reduce heat dissipation and cut down the cost of end systems, thereby accelerating electric vehicle adoption rates.

Applied Materials’ latest Sustainability Report demonstrates the company’s continued dedication to, and wide-ranging progress towards, its ESG strategy and commitments.

We are in awe of the arts groups and their leaders whose tremendous creativity and clever use of technology brought artists and audiences together for powerful, entertaining, engaging experiences all while we sheltered in place.

At Applied’s 2021 Logic Master Class held today, the company showcased several innovations that help solve key logic scaling challenges and deliver continued improvements in PPACt™ at 3nm and beyond.