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Unless we can solve pattern variability challenges, we won’t be able to further scale logic chips and provide users with simultaneous improvements in power, performance and cost. Innovations in “DTCO” and materials engineering are here to help.
While transistor performance improves with scaling, the same cannot be said for interconnects. In fact, interconnect resistance increases as we move to smaller process nodes, which compromises device performance and power consumption. To continue scaling interconnects in advanced logic requires innovations in materials engineering.
eBeam technology is used in a variety of process control and monitoring applications to help optimize the quality and stability of device fabrication as discussed in the video and summarized in an infographic.
The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.