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Adding Sustainability to the Definition of Fab Performance

Nov 09, 2021

To enable a more sustainable semiconductor industry, new fabs must be designed to maximize output while reducing energy consumption and emissions. In this blog post, I examine Applied Materials’ efforts to drive fab sustainability through the process equipment we develop for chipmakers. It all starts with an evolution in the mindset of how these systems are designed.

Emerging Technologies

Now is the Time for Flat Optics

by Dante Zakhidov, Paul Gallagher David Sell, Ph.D. Robert Visser, Ph.D.

Oct 22, 2021

For many centuries, optical technologies have utilized the same principles and components to bend and manipulate light. Now, another strategy to control light—metasurface optics or flat optics—is moving out of academic labs and heading toward commercial viability.

Semiconductors

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

by Maayan Bar-Zvi

Oct 18, 2021

The patterning challenges of today’s most advanced logic and memory chips can be solved with a new playbook that takes the industry from optical target-based approximation to actual, on-device measurements; limited statistical sampling to massive, across-wafer sampling; and single-layer patterning control to integrative multi-layer control. Applied’s new PROVision® 3E system is designed to enable this new playbook.

Semiconductors

Silicon Carbide is Paving the Way for Wider Adoption of Electric Vehicles

by Llew Vaughan-Edmunds

Jul 16, 2021

Compound semiconductors like silicon carbide (SiC) signal a new era of materials engineering in the automotive semiconductor market, one that can significantly increase efficiency, reduce heat dissipation and cut down the cost of end systems, thereby accelerating electric vehicle adoption rates.

Corporate

Corporate Responsibility

New Sustainability Report Highlights Progress on Challenging Goals

by Chris Librie

Jun 30, 2021

Applied Materials’ latest Sustainability Report demonstrates the company’s continued dedication to, and wide-ranging progress towards, its ESG strategy and commitments.

Corporate Responsibility

Finding New Ways to Connect Audiences and Artists

by Siobhan Kenney

Jun 23, 2021

We are in awe of the arts groups and their leaders whose tremendous creativity and clever use of technology brought artists and audiences together for powerful, entertaining, engaging experiences all while we sheltered in place.

Semiconductors

Materials Engineering is Key to Enabling Continued Logic Scaling

by Uday Mitra, Ph.D.

Jun 16, 2021

At Applied’s 2021 Logic Master Class held today, the company showcased several innovations that help solve key logic scaling challenges and deliver continued improvements in PPACt™ at 3nm and beyond.

Semiconductors

Solving Pattern Variability is Critical to Further Scaling Advanced Logic Chips

by Regina Freed

Jun 15, 2021

Unless we can solve pattern variability challenges, we won’t be able to further scale logic chips and provide users with simultaneous improvements in power, performance and cost. Innovations in “DTCO” and materials engineering are here to help.

Semiconductors

Challenges to Interconnect Scaling at 3nm and Beyond

by Mehul Naik, Ph.D.

Jun 14, 2021

While transistor performance improves with scaling, the same cannot be said for interconnects. In fact, interconnect resistance increases as we move to smaller process nodes, which compromises device performance and power consumption. To continue scaling interconnects in advanced logic requires innovations in materials engineering.

Semiconductors

New Innovations Needed to Continue Scaling Advanced Logic

by Mike Chudzik, Ph.D.

Jun 10, 2021

At our upcoming Logic Master Class, experts from Applied and the industry will shed light on the innovations needed to enable advanced logic to further scale and deliver improvements in PPACt. In this blog I give a preview of what we’ll be discussing related to transistor design and scaling challenges.

Emerging Technologies

Seeing a Bright Future for Flat Optics

by Dante Zakhidov, Sage Doshay, Ph.D. David Sell, Ph.D. Robert Visser, Ph.D.

May 27, 2021

We are at the beginning of a new technological era for the field of optics. To accelerate the commercialization of Flat Optics, a larger collaborative effort is needed to scale the technology and deliver its full benefits to a wide range of applications.

Emerging Technologies

Semiconductors

Introducing Breakthroughs in Materials Engineering for DRAM Scaling

by Sony Varghese

May 05, 2021

To help the industry meet global demand for more affordable, high-performance memory, Applied Materials today introduced solutions that support three levers of DRAM scaling: a new hard mask material for capacitor scaling, a low-k dielectric material for the interconnect wiring, and the adoption of high-k metal gate transistors for advanced DRAM designs.

Make Possible

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Adding Sustainability to the Definition of Fab Performance

Now is the Time for Flat Optics

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

Silicon Carbide is Paving the Way for Wider Adoption of Electric Vehicles

New Sustainability Report Highlights Progress on Challenging Goals

Finding New Ways to Connect Audiences and Artists

Materials Engineering is Key to Enabling Continued Logic Scaling

Solving Pattern Variability is Critical to Further Scaling Advanced Logic Chips

Challenges to Interconnect Scaling at 3nm and Beyond

New Innovations Needed to Continue Scaling Advanced Logic

Seeing a Bright Future for Flat Optics

Introducing Breakthroughs in Materials Engineering for DRAM Scaling