Amid a slowdown in classic Moore’s Law scaling, heterogeneous design and advanced packaging play a growing role in the logic roadmap.

In the regions where we work and live, we are addressing immediate humanitarian needs while working with key strategic partners to combat the long-term effects of the COVID-19 pandemic on local communities and the nonprofit sector.

We reflect on the outcomes and activities one year after the launch of Applied’s girl’s empowerment program.

Applied is honored to be recognized among Intel’s 2019 Preferred Quality Supplier (PQS) award winners.

Our latest in a series of blogs inspired by Applied Materials’ panel discussion at IEDM explores where and how data should be processed and stored to drive computing efficiency while curbing energy consumption.

Employees across the globe stepped up to help feed our neighbors in Applied Materials’ annual Fight Against Hunger.

Applied Materials moderated a thought-provoking panel discussion during IEDM which showed that while there is no single path to achieving continued improvements in chip performance, power and area-cost, the industry will be well-served to search for solutions together.

What’s clear from the panel discussion I recently moderated with Facebook, IBM, Intel, Stanford and TSMC is that the semiconductor design and manufacturing model is evolving and will look extremely different in the years ahead.

Happy holidays to all of our readers and best wishes for a wonderful new year! Click to view our holiday video.