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The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Sep 08, 2021

At the Applied Materials Master Class today, we highlight two fast-growing and highly enabling areas of the semiconductor industry. “ICAPS” silicon powers billions of new devices on the edge—including electric vehicles. No longer an afterthought, packaging now enables the benefits associated with Moore’s Law to continue even as 2D scaling slows. Today’s class demonstrates that the AI Era requires innovation across a wide range of technologies, from the edge to the cloud.

Semiconductors

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as Classic Moore’s Law Scaling Slows

by Nirmalya Maity, Ph.D.

Sep 02, 2021

Applied’s upcoming, Sept. 8 Master Class features the topic of heterogeneous design and advanced packaging. In this blog I preview why the role of packaging has evolved from simply protecting and connecting chips to circuit boards, to now being a competitive imperative for the world’s leading semiconductor and systems companies.

Semiconductors

Not All Semiconductor Innovation Occurs at the Leading Edge

by Mike Chudzik, Ph.D.

Aug 27, 2021

As everyday products like phones and cars get smarter, they demand more silicon, much of which is not leading-edge logic and memory. Applied Materials’ ICAPS group was formed to solve the unique design and manufacturing challenges of devices built using process nodes that are no longer found at the leading edge. In this blog I outline why devices in this segment are experiencing a renaissance of innovation.

Corporate Responsibility

Heading Back to School

by Julie Lata

Aug 27, 2021

As the 2021-22 school year begins, we are thankful for the dedication, passion and grit of education providers around the world.

Corporate

Corporate Responsibility

Applied Materials Joins Industry Leaders to Foster Workplace Diversity and Inclusion

by Pamela Sherman

Aug 17, 2021

Alliance for Global Inclusion aims to improve diversity and inclusion across industries with goals tied to representative leadership, inclusive product development and broader access to STEM education for underserved communities.

Semiconductors

Leading Chipmakers Aim to Make New Fabs More Sustainable

by Jim L’Heureux, Andreas Neuber, Ph.D.

Jul 23, 2021

In this blog, I look at ways Applied Materials is working with leading customers who wish to sustainably increase production to meet the world’s growing need for semiconductors. About half of the opportunity lies in the sub-fab, the often-overlooked world of support equipment below the production floor that consumes around half of the energy needed by modern fabs.

Semiconductors

Silicon Carbide is Paving the Way for Wider Adoption of Electric Vehicles

by Llew Vaughan-Edmunds

Jul 16, 2021

Compound semiconductors like silicon carbide (SiC) signal a new era of materials engineering in the automotive semiconductor market, one that can significantly increase efficiency, reduce heat dissipation and cut down the cost of end systems, thereby accelerating electric vehicle adoption rates.

Corporate

Corporate Responsibility

New Sustainability Report Highlights Progress on Challenging Goals

by Chris Librie

Jun 30, 2021

Applied Materials’ latest Sustainability Report demonstrates the company’s continued dedication to, and wide-ranging progress towards, its ESG strategy and commitments.

Corporate Responsibility

Finding New Ways to Connect Audiences and Artists

by Siobhan Kenney

Jun 23, 2021

We are in awe of the arts groups and their leaders whose tremendous creativity and clever use of technology brought artists and audiences together for powerful, entertaining, engaging experiences all while we sheltered in place.

Semiconductors

Materials Engineering is Key to Enabling Continued Logic Scaling

by Uday Mitra, Ph.D.

Jun 16, 2021

At Applied’s 2021 Logic Master Class held today, the company showcased several innovations that help solve key logic scaling challenges and deliver continued improvements in PPACt™ at 3nm and beyond.

Semiconductors

Solving Pattern Variability is Critical to Further Scaling Advanced Logic Chips

by Regina Freed

Jun 15, 2021

Unless we can solve pattern variability challenges, we won’t be able to further scale logic chips and provide users with simultaneous improvements in power, performance and cost. Innovations in “DTCO” and materials engineering are here to help.

Semiconductors

Challenges to Interconnect Scaling at 3nm and Beyond

by Mehul Naik, Ph.D.

Jun 14, 2021

While transistor performance improves with scaling, the same cannot be said for interconnects. In fact, interconnect resistance increases as we move to smaller process nodes, which compromises device performance and power consumption. To continue scaling interconnects in advanced logic requires innovations in materials engineering.

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The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as Classic Moore’s Law Scaling Slows

Not All Semiconductor Innovation Occurs at the Leading Edge

Heading Back to School

Applied Materials Joins Industry Leaders to Foster Workplace Diversity and Inclusion

Leading Chipmakers Aim to Make New Fabs More Sustainable

Silicon Carbide is Paving the Way for Wider Adoption of Electric Vehicles

New Sustainability Report Highlights Progress on Challenging Goals

Finding New Ways to Connect Audiences and Artists

Materials Engineering is Key to Enabling Continued Logic Scaling

Solving Pattern Variability is Critical to Further Scaling Advanced Logic Chips

Challenges to Interconnect Scaling at 3nm and Beyond