In our Battle of Exponentials framework, data grows exponentially as Moore’s Law slows, creating increased demand for silicon and wafer fab equipment. Are there enough valuable applications to fuel data growth as capital intensity rises? We believe so. In this blog post I focus on the promise of tokenization to digitize and democratize virtually all kinds of transactions.

We’ve received great feedback on our “Battle of Exponentials” framework, which examines the market impacts we’ve observed since around 2015 as data generation continued to expand at an exponential rate while classic Moore’s Law scaling slowed. In this blog post we focus on the step-up in NAND equipment capital intensity that occurred during the transition from 2D to 3D NAND architectures.

Through the Applied Materials Foundation’s girls empowerment initiative, we are expanding the pipeline of Black and Latinx female talent.

In communities around the world, Applied Materials employees have stepped up to help provide nutritious meals to those in need, including the largest ever contributions in North America.

After declining significantly from a peak in 2000, wafer fab equipment (WFE) intensity has been on an uptrend in recent years. As a result, semiconductor equipment revenue growth has been outpacing semiconductor growth. 

In this blog I illustrate how the semiconductor revenue CAGR has increased in recent years and explain why growth could continue at this higher rate for the foreseeable future.

The continued growth of Applied Materials’ business means we need to work harder to manage our energy consumption and greenhouse gas footprint. While recent ratings show we’re continuing to make progress toward our climate goals, we’re busy developing new ways to maintain our momentum.

Semiconductor growth has accelerated to higher levels that may represent a new normal as suggested by our “battle of exponentials” framework.

Applied Materials recently entered a new phase of our R&D collaboration with A*STAR’s Institute of Microelectronics to accelerate materials, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.