DRAM Scaling Requires New Materials Engineering Solutions

The AI Era of computing is fueling exponential growth in data generation, and the entire technology ecosystem depends on the semiconductor industry finding new ways to scale DRAM architectures to keep pace with bit demand. New hard mask patterning films can enable thinner capacitors with the highest possible aspect ratios, while new dielectric insulating materials can reduce the spacing between metal lines, both resulting in new ways to shrink.

Introducing a New Playbook in Process Control

Applied Materials is reinventing process control with a new solution, unveiled today, that uses Big Data and AI to find yield-killing defects better, faster and more cost effectively than legacy approaches. The solution allows chipmakers to accelerate yields and time to market of semiconductor process technologies and fabs.