Silicon Precision Industries Recognizes Applied Materials for Outstanding Performance

Roger TH Chang, AGM China/OSAT for Applied Materials (center right), received the award on behalf of the Applied Materials team from Patrick Lin (center left).   

Siliconware Precision Industries Co., Ltd (SPIL) recently honored Applied Materials with the “Outstanding Performance Award” in recognition of its partnership for Through Silicon Via (TSV) research and development.

SPIL, based in Taichung, Taiwan has become one of the leading providers of comprehensive semiconductor assembly and test services.

Patrick Lin, Vice President Operation Supporting Division, SPIL, said, “This is the first time SPIL presents this award to an equipment supplier, for support in SPIL TSV development and bumping.” 

Advanced Packaging enables steady growth; we believe that TSV is the up-and-coming marketable technology which will provide a new level of service to our Foundry, IDM and OSAT customers,” said Mr. Lin, “We are counting on your further support.”

"By partnering with Applied and having your Advanced Product Development Center running parallel development, SPIL is able to shorten development cycle time and is well prepared for challenges in process integration,” said Dr. Mike Ma, Vice President, Corporate R&D, SPIL.

The teams at Applied Materials include the Taiwan SSG Process Support Engineering team headed by Daniel Liao and his team: Denny Tsai, Sem Huang, Domingo Chou and Travis Huang; Applied Global Services (AGS) Field Service Operations led by Arthur Liu, and his team: Edwin Shih, Yung Fwu Lee and Simon Liang; AGS Sales led by Michael YC Wang and Michael Lee; and SSG OSAT Account Sales led by Sebastian Yu and Will Wu, with Sesh Ramaswami and Niranjan Kumar from SSG CTO Office, and Key Account Technologists, Total Product Support, Regional Product Management teams for Etch, Dielectric Systems & Modules, Metal Deposition Products, Semitool Business Unit, Chemical Mechanical Planarization from Santa Clara, CH Toh and Asia Product Development Center in Singapore who were all crucial to the project’s success.

Presented every two years, the award recognizes SPIL’s most respected suppliers. The award marks a milestone in our partnership with SPIL, which began in 2003 and continues to grow as we collaborate on TSV backside via reveal (BVR), 2.5D interposer and Dual Damascene.

Congratulations to the Applied Materials OSAT team!

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