Semiconductors

An in-depth review of the power device market and changes driving technology innovations.

Evolutionary changes in materials and device structures critical for next generation of device scaling.

An animation shows the complexity of a FinFET array and examples of the defects that can occur during device fabrication but are difficult to detect among densely packed, high aspect ratio features.

The newest in Applied Materials’ suite of ebeam products, the PROVision™ system, delivers the industry’s highest resolution at the fastest throughput, detecting defects never before seen. Watch this brief video to learn more about this breakthrough system and the challenges it solves.

eBeam technology is used in a variety of process control and monitoring applications to help optimize the quality and stability of device fabrication as discussed in the video and summarized in an infographic.

An in-depth review of the challenges of materials and processing in the changing memory landscape.

The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.

Applied Materials will take part in several presentations and panel discussions that showcase how materials engineering is enabling technology inflections.

Advanced, self-aligned multi-patterning schemes that extend current lithography require extreme selectivity.