Semiconductors

3D NAND is getting closer to becoming a mainstream technology. However, there is still work to be done for it to make its way into the cost-sensitive consumer market.

Applied's Sree Kesapragada and Miller Allen, discuss the Endura Cirrus HTX which meets chipmakers’ copper interconnect patterning needs by extending the TiN metal hardmask —the industry’s material of choice — to the 10nm and below nodes.

Investors and entrepreneurs converged at the third annual Silicon Innovation Form at SEMICON West to pitch new technologies, collaborate with ecosystem partners and spark new innovations.

Technology experts will lead sessions covering emerging memory technology; scaling transistors; interconnect technology for high performance computing; and the factory of the future.

The VC ecosystem continues to evolve and according to the National Venture Capital Association, corporate investors are becoming an increasingly important source of venture capital. Applied Ventures discusses what's driving this changing landscape and the unique value corporate VCs bring to the table.

Applied Materials will host a forum at the IITC* conference in Grenoble, France on May 19 to discuss ways of overcoming critical challenges in copper interconnect scaling. While much of the industry’s focus has been on transistor scaling, at the 10nm node and beyond, the interconnect is becoming a major issue. Applied Materials and guest speakers will explore the path that interconnect technology must take to keep pace with Moore’s Law in a panel titled "Advancing the Frontiers of Interconnect Scaling."

What are some of the innovations behind Moore’s Law? As technology advancement continues full steam ahead, Applied Materials recognizes and celebrates Moore’s Law on its 50th anniversary.

For the 5th consecutive year, Applied Materials has been recognized with Intel Corporation’s Preferred Quality Supplier award.

2014 marked an exciting and active year, where Applied Ventures closed four new investments in early stage technology companies. The most recent investment is RayVio Corporation, a solid state ultraviolet (SSUV) light emitting diode (LED) startup first developed at Boston University and backed by some of the world’s leading investors.