Applied Materials is chairing a panel discussion with memory technology leaders including Intel, Samsung, SK hynix and Western Digital to address new types of storage class memory as part of the eighth IEEE International Memory Workshop on May 16.
Applied's Shirley Hemar talks about the higher inspection sensitivity requirements of manufacturing 10nm and beyond designs and how the UVision 7’s technical innovations meet the scaling challenges.
3D NAND is getting closer to becoming a mainstream technology. However, there is still work to be done for it to make its way into the cost-sensitive consumer market.
Applied's Sree Kesapragada and Miller Allen, discuss the Endura Cirrus HTX which meets chipmakers’ copper interconnect patterning needs by extending the TiN metal hardmask —the industry’s material of choice — to the 10nm and below nodes.
Investors and entrepreneurs converged at the third annual Silicon Innovation Form at SEMICON West to pitch new technologies, collaborate with ecosystem partners and spark new innovations.
Technology experts will lead sessions covering emerging memory technology; scaling transistors; interconnect technology for high performance computing; and the factory of the future.
The VC ecosystem continues to evolve and according to the National Venture Capital Association, corporate investors are becoming an increasingly important source of venture capital. Applied Ventures discusses what's driving this changing landscape and the unique value corporate VCs bring to the table.
