Semiconductors

New flexible system delivers best-in-class performance and productivity for the full range of plating steps used in diverse advanced packaging schemes.

Applied Materials is the market leader for the fourth consecutive year; achieves the highest year-over-year growth among the top five companies. 

Proliferating mobile, “smart” electronic consumer products, Internet of Things devices, and high-performance computing applications are driving greater complexity in wafer-level packaging schemes and expanding the number of electrochemical deposition steps in their fabrication.

The Preferred Quality Supplier award celebrates exceptional, persistent performance and the continuous pursuit of excellence.

There’s an emerging class of MEMS devices including fingerprint sensors and MEMS-based LIDAR that are poised to help improve our lives.

The power device landscape has become more complicated and fragmented with technology and roadmap changes, and consolidation among device manufacturers.

Scaling and emerging applications are driving market and technology changes.

Changing materials in the contact can lower resistance and improve yield in sub-10nm chip designs.

While the mainstay applications of the MEMS segment continue to be strong performers, 2016 saw a big push toward lots of new and potentially high-volume MEMS devices. This presents many exciting opportunities, but the challenges are plenty.