Semiconductors

Changing materials in the contact can lower resistance and improve yield in sub-10nm chip designs.

While the mainstay applications of the MEMS segment continue to be strong performers, 2016 saw a big push toward lots of new and potentially high-volume MEMS devices. This presents many exciting opportunities, but the challenges are plenty.

Applied Materials reports on recent R&D achievements for manufacturing 3D transistors and new memory technologies.

Reducing human variability improves problem solving and brings new levels of efficiency and quality to the fab.

Applied Materials hosted an Open Innovation Workshop in Shanghai where company experts joined industry and academic leaders to explore how materials engineering can help transform sectors of the global economy.

A discussion with VLSIresearch Inc.’s G. Dan Hutcheson on new materials and processing requirements for memory technologies.

The development of power IC manufacturing in China is being facilitated by the large number of 200mm fabs in the country.

Applied Materials will be presenting in five sessions at PRiME 2016, one of the largest international research conferences, being held October 2-7 in Honolulu, Hawaii.

New materials offer competitive benefits over silicon in a growing number of power device applications, but cost and technology challenges remain daunting.