Semiconductors

India’s Semiconductor Manufacturing Policy

India’s Semiconductor Manufacturing Policy

Applied Materials was recently featured in an article for The Hindu Business Line regarding semiconductor manufacturing in India. Below are short excerpts from the article including quotes from Dr. Randhir Thakur, Executive Vice President and General Manager, Silicon Systems Group who was interviewed for the feature.
A Trip to Gadgets “R” Us

A Trip to Gadgets “R” Us

On exhibit at CES - “Surface PCs"  - a PC with a very large unbreakable screen with touch panel capability.At this year’s Consumer Electronics Show (CES) in Las Vegas, 140,000 attended to check out the 20,000 products being introduced. Luckily, it was a tradeshow, so they don’t actually sell you any of the gadgets, otherwise, I could've really burned a hole in my wallet. Here’s a quick recap of what I noticed at this year’s Gadgets "R" Us.
LED Automation Software: Understanding the Process Through Data is an Important First Step

LED Automation Software: Understanding the Process Through Data is an Important First Step

Previously, I wrote about how LED manufacturers were striving to shorten the time between initiating the LED manufacturing process and measuring their performance in an effort to improve the product yields and possibly even boost LED performance.Certainly one of the keys to making this possible is having rapid access to manufacturing data. There are many ways to gather data for analysis by the process engineers.
Applied Materials

Supply Chain Collaboration for 3D Interconnect Applications

3D Interconnect applications are attracting more and more interest from a large number of players in the semiconductor industry. I recently participated in two conferences (IWLPC – International Wafer Level Packaging Conference and IMAPS- International Microelectronics and Packaging Society Conference) on this topic to keep up-to-date on the new activities and developments in the industry and to share our latest advancements achieved with EMC3D consortium.
Applied Materials

Opportunities in Through-Silicon Via Technology for 3D Packaging

The industry has reached a crucial inflection point on the adoption and commercialization of 3D packaging technology, and Applied Materials’ CTO Hans Stork gave attendees of the 3D Architectures for Semiconductor Integration and Packaging conference held recently in Burlingame, Calif. his assessment on the current status of this emerging technology.According to Stork, though significant challenges remain with vertical interconnects using through-silicon vias (TSVs), the semiconductor industry is on the verge of turning this into a manufacturing technology.
Vacuum Valves and Mercury Memory: Remembering Sir Maurice Wilkes

Vacuum Valves and Mercury Memory: Remembering Sir Maurice Wilkes

Maurice Wilkes inspecting a mercury delay line memory.Copyright Computer Laboratory, University of Cambridge. Reproduced by permission.The semiconductor industry is constantly producing new innovations that enrich our lives. But, we stand on the shoulders of giants. Sir Maurice Wilkes, who passed away on November 29th this year, was one of the tallest.Sir Maurice is credited with several pioneering developments in computing, but is best known for leading the team at Cambridge University in England that developed EDSAC, the first truly modern computer, which ran its first program in 1949.
From Shy Student to Engaging Engineer

From Shy Student to Engaging Engineer

Applied Materials engineer Rozalia Beica guest-blogs for The Huffington Post's education section in a blog post published this week as part of non-profit organization Change The Equation 's campaign encouraging education in science, technology, engineering and math (STEM).  Rozalia's inspiring story speaks to how she stumbled into the engineering field as a shy student and eventually came to love engineering and the excitement and collaboration of working in the semiconductor industry.  She is now seen as an expert in the field helping to enable cutting edge technology of the future as part of Applied Materials' Silicon Systems Group .
Will Future Transistors Appear in Glorious 3D?

Will Future Transistors Appear in Glorious 3D?

Imagine two micrographs side-by-side, one of a transistor from an Intel 286 microprocessor from 1982 and one of a transistor from the brains of the latest smartphone. While they appear quite similar, the new one is 100 times smaller.But conventional transistor scaling is reaching its limits. Beyond the 22nm technology node – sometime in the middle of this decade – traditional two-dimensional, or planar, transistors may be a thing of the past. To continue the incredible advances in speed, battery life and cost, the technology must change. Two new approaches are being considered: three-dimensional transistors and enhancements to planar transistors.I recently attended a forum that Applied Materials hosted in San Francisco where a panel of experts debated the relative merits of these approaches. Speaking to an audience of over 200 technologists, the panel included experts from leading chip companies: GlobalFoundries, IBM, Qualcomm, Samsung and STMicroelectronics and was moderated by Professor Yuan Taur from U.C. San Diego.
Employee Reflects on Career in IT

Employee Reflects on Career in IT

Applied Materials' Christi Marrufo shares her career path in the high tech industry in a recent issue of Workforce Diversity for Engineering and IT Professionals magazine.In a feature on computer science as a top career field, Christi details her responsibilities as Director of Front End Services, Global Information Services, and speaks to what she enjoys most about working in the IT industry.  Below is an excerpt from the article: