The newest in Applied Materials’ suite of ebeam products, the PROVision™ system, delivers the industry’s highest resolution at the fastest throughput, detecting defects never before seen.
Watch this brief video to learn more about this breakthrough system and the challenges it solves.
eBeam technology is used in a variety of process control and monitoring applications to help optimize the quality and stability of device fabrication as discussed in the video and summarized in an infographic.
The industry's first extreme selectivity etch tool introduces new materials engineering capabilities for the next generation of self-aligned patterning schemes and future scaling of 3D logic and memory chips.
Applied Materials is chairing a panel discussion with memory technology leaders including Intel, Samsung, SK hynix and Western Digital to address new types of storage class memory as part of the eighth IEEE International Memory Workshop on May 16.
Applied's Sree Kesapragada and Miller Allen, discuss the Endura Cirrus HTX which meets chipmakers’ copper interconnect patterning needs by extending the TiN metal hardmask —the industry’s material of choice — to the 10nm and below nodes.