Perspectives on the Semiconductor Industry in the Year Ahead
At the beginning of each year, media outlets publish forecast articles with expectations for the year ahead. Two of our executives recently shared their perspectives on what 2017 holds in store for the semiconductor industry.
Prabu Raja, vice president and general manager of the Patterning and Packaging Group, provided his assessment of the major technology trends for 2017 to Solid State Technology, a leading industry magazine that delivers the latest in electronics and semiconductor manufacturing news, analysis and product information. Prabu sees continued scaling of 3D NAND devices to 64 layers, ramping of the 10nm process node into volume manufacturing and the rapid adoption of highly integrated chip packages as being among the key developments for the industry.
Arthur Sherman, vice president of Corporate Strategy and Marketing, shared his business outlook with Semiconductor Packaging News, an email newsletter with links to important industry and technology news stories and feature articles. Arthur emphasized how Applied is well positioned to benefit from a number of emerging trends such as the IoT, cloud infrastructure, artificial intelligence, augmented and virtual reality and smart vehicles. He also points out how the increased demand for a broader mix of chips to serve the more diversified variety of applications has changed the semiconductor industry, making it much less volatile. This trend supports Applied’s view that demand for semiconductors and capital equipment is becoming less cyclical – a major advantage for the entire industry ecosystem.