MEMS In the Mainstream

Nov22011

The Micro-Electro-Mechanical Systems (MEMS) – Executive Congress is now in its seventh year and with over 200 people in planned attendance, this years’ gathering is promising to be the largest in the history of the event. Organized by the MEMS Industry Group (MIG), executive congress is focused on drawing together executives from across the MEMS supply chain to meet and discuss topics ranging from end-user applications to new technologies and current go-to-market strategies for MEMS.

The theme for this years’ executive congress is ‘MEMS in the Mainstream.’ The two day event plays host to a number of keynote speakers covering topics on ‘Accelerating Innovation’ and ‘Change in the Market Place.’ In addition to these there are a number of industry panels covering topics including MEMS Market Analysis, MEMS Foundry Models, MEMS in Consumer Products and the hotly debated topic of MEMS Sensor Fusion. A new addition to this year’s industry panel is the ‘MEMS Application Showcase.’ The application showcase is where companies get to show off their MEMS devices, demonstrating their use in end user devices and talking the audience through the technology that makes their functions possible!

Applied Materials is proud to be a gold sponsor for this years’ event and will feature Applied Global Services’ MEMS focused product portfolio. As MEMS Global Product Manager in the 200mmEquipment Product Group, I’ll present briefly on progress we’ve made in MEMS technology over the past year. This includes advancements in our MEMS product offering including, low (~0.5%) non-uniformity AlN, thick (>20µm) CVD processes and, as shown in the image below, ultra high aspect ratio processing for next-gen MEMS as part of a Deep Reactive Ion Etch (DRIE) development program.

Since DRIE is recognized as a critical enabling technology for the manufacture of many of today’s MEMS devices (e.g., Gyroscopes, accelerometers), demonstration of advanced fabrication technologies such as this is key to enabling the designers of next generation MEMS devices. Demonstrating the ability to reliably reduces the spacings (from todays’ current state of the art 1µm to 100’s of nm) between capacitive sensing areas in devices such as gyroscopes and accelerometers, provides options around device size, drive voltage, sensitivity, or layer thickness which can directly impact productivity in other areas of the device fabrication flow. The development and demonstration of such technologies is key to both further evolving MEMS device technology and proving the Applied Materials’ commitment to the MEMS industry.

As the technical requirements and volume of the MEMS industry continue to evolve and grow, Applied Materials is excited to be part of this process, supporting our customers and delivering outstanding technologies based upon proven manufacturing tools and processes.

If you have any questions leave them as comments below or meet me at the MEMS Congress.

 

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