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Robert Betts is responsible for wafer-level packaging electrochemical deposition (ECD) products, including the technology roadmap, product training of field personnel, product marketing and customer relations. He earned a B.S. in chemical engineering from Montana State University in Bozeman and has authored a variety of technical publications.
Proliferating mobile, “smart” electronic consumer products, Internet of Things devices, and high-performance computing applications are driving greater complexity in wafer-level packaging schemes and expanding the number of electrochemical deposition steps in their fabrication.