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Mehul Naik is a Principal Member of Technical staff with the Advanced Product Technology Development team in the Transistor and Interconnect Group at Applied Materials. He is responsible for the Interconnect Program and serves as a cross-functional owner of Applied’s interconnect roadmap. He has authored over 40 publications and holds 49 U.S patents on various topics including Cu and alternate metallization, CMP, selective deposition, process flows, low k integration, and double patterning. Mehul holds a Ph.D. in Chemical Engineering from Rensselaer Polytechnic University.
As the semiconductor industry begins producing logic devices for the single digit nodes, new conductors are being evaluated as replacements for copper to manage resistance scaling. Applied Materials’ Mehul Naik highlights one of the leading contenders.