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Ehud (Udi) Tzuri served as Chief Marketing Officer of Applied Materials Process Diagnostics and Control group based in Rehovot, Israel. Ehud was with the company for almost 20 years working in Application Engineering and Marketing for various areas of Metrology and Inspection.
Applied Materials technologists will discuss the latest challenges and innovations in semiconductor manufacturing including mask and wafer patterning, inspection and metrology to help address key scaling issues.
As integrated circuit (IC) manufactures continue to pursue Moore’s Law, smaller and smaller features are printed on chips. That’s an easy statement to make, but in practice it is very difficult and complicated to do, especially when there are tiny defects that are practically invisible.
A defect can be a small particle, a scratch or a bump on the surface of a wafer, a void in the material or a bridge between two lines. Some are big — although big in our world means just a few millionths of a meter — and some are very small.