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New materials and integrated process approaches offered on the Producer platform will help to enable future semiconductor designs.

Wishing our readers all the elements for a joyful holiday season and a happy new year!

I recently sat down for a video interview with G. Dan Hutcheson, CEO of VLSIresearch, to discuss why the industry is moving to new memory solutions and what strategies are being implemented to alleviate the memory bottleneck.

Max McDaniel reports on the hottest display trends coming out of this year’s Consumer Electronics Show in Las Vegas.

Happy Holidays from the Applied Materials blog team!  http://bit.ly/2hWsKb0

A discussion with VLSIresearch Inc.’s G. Dan Hutcheson on new materials and processing requirements for memory technologies.

An animation shows how collecting a massive number of measurements and mapping them across a wafer reveal valuable information on process variations to expedite identifying the root cause. 

An animation shows the complexity of a FinFET array and examples of the defects that can occur during device fabrication but are difficult to detect among densely packed, high aspect ratio features.

The newest in Applied Materials’ suite of ebeam products, the PROVision™ system, delivers the industry’s highest resolution at the fastest throughput, detecting defects never before seen. Watch this brief video to learn more about this breakthrough system and the challenges it solves.