TSV

MEMS in the Mainstream: Zurich Edition

MEMS in the Mainstream: Zurich Edition

Anyone who’s anyone in the Micro-Electro-Mechanical Systems (MEMS) community descended upon Zurich in Switzerland earlier this month for the first ever European MEMS Executive Congress. Organized by the MEMS Industry Group (MIG), and sponsored in part by Applied Materials, the congress draws together executives from across the MEMS value chain to discuss topics ranging from end-user applications to new technologies and current go-to-market strategies for MEMS. 
Enabling Future Memory Devices

Enabling Future Memory Devices

As memory scaling proceeds, the industry is evaluating a variety of options for achieving the performance required from sub-2X memory devices.DRAM, Flash, and emerging memory development each face unique complexities and unknowns. What will DRAM technology look like in three to five years? What is the next big growth area for the NAND market? What’s next in emerging memory? Is a universal memory format the next technology?In conjunction with the International Memory Workshop 2011 on May 23 in Monterey, California, Applied Materials will host a panel discussion with distinguished speakers from Hynix, IMEC, Nokia, Samsung, and Toshiba for a thought-provoking and lively conference session discussing these questions and related topics.
Applied Materials

Opportunities in Through-Silicon Via Technology for 3D Packaging

The industry has reached a crucial inflection point on the adoption and commercialization of 3D packaging technology, and Applied Materials’ CTO Hans Stork gave attendees of the 3D Architectures for Semiconductor Integration and Packaging conference held recently in Burlingame, Calif. his assessment on the current status of this emerging technology.According to Stork, though significant challenges remain with vertical interconnects using through-silicon vias (TSVs), the semiconductor industry is on the verge of turning this into a manufacturing technology.