Anyone who’s anyone in the Micro-Electro-Mechanical Systems (MEMS) community descended upon Zurich in Switzerland earlier this month for the first ever European MEMS Executive Congress. Organized by the MEMS Industry Group (MIG), and sponsored in part by Applied Materials, the congress draws together executives from across the MEMS value chain to discuss topics ranging from end-user applications to new technologies and current go-to-market strategies for MEMS.
As memory scaling proceeds, the industry is evaluating a variety of options for achieving the performance required from sub-2X memory devices.
DRAM, Flash, and emerging memory development each face unique complexities and unknowns. What will DRAM technology look like in three to five years? What is the next big growth area for the NAND market? What’s next in emerging memory? Is a universal memory format the next technology?
In conjunction with the International Memory Workshop 2011 on May 23 in Monterey, California, Applied Materials will host a panel discussion with distinguished speakers from Hynix, IMEC, Nokia, Samsung, and Toshiba for a thought-provoking and lively conference session discussing these questions and related topics.
According to Stork, though significant challenges remain with vertical interconnects using through-silicon vias (TSVs), the semiconductor industry is on the verge of turning this into a manufacturing technology.
At this year's SEMICON West 2010, Applied Materials introduced the Producer Avila system, the latest innovation for TSV production. Sesh Ramaswami, Senior Director, Through-Silicon Via Program discusses how Applied Materials is leading the next technology inflection to advance Through-Silicon Via (SV) technology for high-volume manufacturing.