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Applied Materials

TOTAL RECALL: Advanced Memory Technologies for Higher Performance & Power Efficiency

Mobile computing is now everywhere, more than ever before as a result of faster and more capable smart phones, tablets, and laptops.Universal mobility and instant-on connectivity may herald a new era in computing, but improvements in key technologies are necessary if we are going to keep up with consumers’ constant demand for higher performance, longer battery life and ultra-sleek profiles.To address these technology improvements and answer key questions that may significantly impact the way we interface with an increasingly connected world, Applied Ventures and the MIT Club of Northern California (MITCNC) will host a lively panel discussion with innovators from across the memory value chain on Wednesday, February 1 at 6:30pm in Santa Clara, Calif.[edit: you can read a report from the session here.]
Beyond 22nm: Applied Materials, the unsung hero of Silicon Valley

Beyond 22nm: Applied Materials, the unsung hero of Silicon Valley

ExtremeTech’s Sebastian Anthony, details Applied Materials’ role in the semiconductor industry and describes the company as the unsung hero of Silicon Valley that has been guiding the leading edge of CMOS processing since before Intel released its 4004 CPU in 1971. Quoted in the story is Applied Materials’ chief technology officer for silicon, Klaus Scheugraf. Visit ExtremeTech’s web site to access the full story or read the following short excerpt.
Celebrating the Integrated Circuit

Celebrating the Integrated Circuit

Fifty-three years ago today, Jack Kilby demonstrated a working integrated circuit (IC). The IC, is arguably the most important invention of the 20th century. The IC made many of the technologies and devices we use possible. I spoke with Applied Materials chief technology officer, Om Nalamasu about the IC and its impact on the hi-tech industry. He suggested, the "IC has been one of the primary contributors in transforming industrial society to Information and knowledge based society.
Applied Materials

Mutual Trust Is Key for Collaborating With China

People's Republic of China President, Hu Jintao and the Honorable Henry Kissinger, former Secretary of State at a DC luncheon in Hu's honor.There was considerable buzz in government, business and media circles recently regarding the state visit of His Excellency, Hu Jintao, President, People’s Republic of China to the U.S. I had the privilege of being in Washington, D.C. during the flurry of diplomatic activities as part of Applied Materials’ participation in a signing ceremony on January 18 on the Solar Decathlon Competition in collaboration with the U.S. Department of Energy, China’s National Energy Administration, and Peking University. There were 18 different collaborations formalized during the ceremony, all part of the official state visit from China’s president.
India’s Semiconductor Manufacturing Policy

India’s Semiconductor Manufacturing Policy

Applied Materials was recently featured in an article for The Hindu Business Line regarding semiconductor manufacturing in India. Below are short excerpts from the article including quotes from Dr. Randhir Thakur, Executive Vice President and General Manager, Silicon Systems Group who was interviewed for the feature.
Applied Materials

Supply Chain Collaboration for 3D Interconnect Applications

3D Interconnect applications are attracting more and more interest from a large number of players in the semiconductor industry. I recently participated in two conferences (IWLPC – International Wafer Level Packaging Conference and IMAPS- International Microelectronics and Packaging Society Conference) on this topic to keep up-to-date on the new activities and developments in the industry and to share our latest advancements achieved with EMC3D consortium.
New Chipmaking Technology Makes Smarter Smartphones

New Chipmaking Technology Makes Smarter Smartphones

Faster, smarter and greener than anything that’s gone before. There’s new technology that’s changing the way chips are made, enabling manufacturers to build processing powerhouses for the mobile devices of the future.It’s becoming incredibly challenging for the industry to shrink chip features to continually deliver higher levels of performance and battery life. Of course, we’ve been saying that for years, but the semiconductor industry always finds a way to extend Moore’s Law, bending the laws of physics in our favor. Today, our customers are working on chips with transistors less than 20nm across: A million of them would fit into the area of the period at the end of this sentence.