Applied Materials introduces the biggest materials change in interconnect technology in 15 years with the announcement of the new Endura® Volta™ CVD system. Its unique cobalt processes ease critical interconnect scaling bottlenecks to enable continued momentum of Moore’s Law.
The Internet of Things (IoT) is set to drive demand and innovation in the semiconductor market over the next decade. While some consumer IoT applications will require semiconductors manufactured using cutting-edge technologies to deliver fast performance and low power consumption, the vast majority of chips for IoT applications will be utilized in client-side applications. These chips, such as a sensor monitoring room temperature in a connected HVAC system, require processing capabilities that can be met using legacy process (90 and 45nm) technologies manufactured on 200mm wafers.
And herein lies the opportunity and challenge for legacy manufacturing.
At the recent SPIE Advanced Lithography conference, my keynote presentation focused on how improvements in metrology, multi-patterning techniques and materials can enable 3D memory and the critical dimension (CD) scaling of device designs to sub-10nm nodes.
Applied Materials technologists will discuss the latest challenges and innovations in semiconductor manufacturing including mask and wafer patterning, inspection and metrology to help address key scaling issues.
Every year, media outlets publish year-end reviews and outlooks for the New Year. Solid State Technology, a leading magazine providing the latest electronics manufacturing news, analysis and product information related to semiconductor manufacturing features an annual outlook and invited Randhir Thakur, Executive Vice President, General Manager, Silicon Systems Group, Applied Materials to give his assessment of the major trends for 2014. He identified the shifts to 20 nanometer designs, FinFET transistors and 3D NAND as the game-changing innovations and discussed how Applied is focused on providing the precision materials engineering solutions to address the challenges involved in advancing these technologies.
2013 was a transformative and exciting year for Applied Materials. It was also a year filled with important achievements in the semiconductor and display industries.
In May, Applied Materials hosted one of the most powerful men in the world, U.S. President Barack Obama. In September we announced that Applied Materials and Tokyo Electron are combining to create a new global innovator for the semiconductor and display industries. It comes to no surprise that these topics are among the most widely read blog posts this past year.
Today marks the 66th birthday of the first working transistor; an opportune time to look back at how far this technological marvel has come. With 66 years of innovations behind it, today’s transistor looks quite different from when it first hit the scene.
First, there are so many of them around today. It’s estimated that more than 1200 quintillion transistors will be manufactured in 2015, making the transistor the most ubiquitous man-made device on the planet.
Last week Applied Materials and Tokyo Electron held a media roundtable in Japan to discuss the merger of equals announced on September 24, 2013. Executives from both companies provided updates on the rationale behind the merger, the status of the integration planning, the expected benefits to employees, customers and the industry, as well as answered questions from the audience.
Tetsuro Higashi, Chairman, President and CEO of Tokyo Electron, who will become Chairman of the new company, and Mike Splinter, Executive Chairman of Applied Materials, who will serve as Vice-Chairman, addressed the audience of more than 20 members of the Japanese media.
One of the biggest developments taking place in the semiconductor industry is the emergence of 3D NAND memory technology. Products are available today that feature 3D NAND devices. It has taken years to become a reality — since Toshiba first discussed the concept of 3D NAND at the VLSI Symposium in 2007 – and now it is poised to replace planar NAND flash memory for storage.
The path that has led to this point is similar to what happened with the logic roadmap; despite innovative workarounds, the era of traditional planar "shrinks" for NAND is running out of steam. And, just as with logic, it has required significant technical advances to overcome the formidable challenges to successfully manufacture complex vertical 3D NAND designs.
I'm proud to share that Applied Materials has once again been recognized today for its outstanding support of military veterans and National Guard and Reserve members, and has been designated a 2014 Military Friendly Employer by G.I. Jobs magazine.
This marks the eighth consecutive year that the company has been included on the list, which was complied from a data-driven survey of more than 5,000 companies whose annual revenues exceeded $500 million.
Applied Materials Executive Chairman Mike Splinter was recognized this week at the Semiconductor Industry Association’s (SIA) 36th annual awards dinner, where he received the Robert N. Noyce Award, the industry’s highest honor, for his significant contributions to the U.S. semiconductor industry in technology and public policy.
A well-known and respected industry veteran, Mike successfully led Applied Materials as CEO for more than a decade, expanding the company’s position as a leading global equipment provider to the semiconductor, display and solar industries, and helping to drive critical innovations in transistor design to further Moore’s Law, the foundation of all...