Today, Applied Materials, Inc., and Tokyo Electron, Ltd., announced exciting news – we are combining our companies to form a new global innovator in the semiconductor and display equipment industries. We are bringing together our complementary strengths to create an expanded set of capabilities in precision materials engineering and patterning that are strategically important for customers.
Last week Applied Materials and Tokyo Electron held a media roundtable in Japan to discuss the merger of equals announced on September 24, 2013. Executives from both companies provided updates on the rationale behind the merger, the status of the integration planning, the expected benefits to employees, customers and the industry, as well as answered questions from the audience.
Tetsuro Higashi, Chairman, President and CEO of Tokyo Electron, who will become Chairman of the new company, and Mike Splinter, Executive Chairman of Applied Materials, who will serve as Vice-Chairman, addressed the audience of more than 20 members of the Japanese media.
One of the biggest developments taking place in the semiconductor industry is the emergence of 3D NAND memory technology. Products are available today that feature 3D NAND devices. It has taken years to become a reality — since Toshiba first discussed the concept of 3D NAND at the VLSI Symposium in 2007 – and now it is poised to replace planar NAND flash memory for storage.
The path that has led to this point is similar to what happened with the logic roadmap; despite innovative workarounds, the era of traditional planar "shrinks" for NAND is running out of steam. And, just as with logic, it has required significant technical advances to overcome the formidable challenges to successfully manufacture complex vertical 3D NAND designs.
I'm proud to share that Applied Materials has once again been recognized today for its outstanding support of military veterans and National Guard and Reserve members, and has been designated a 2014 Military Friendly Employer by G.I. Jobs magazine.
This marks the eighth consecutive year that the company has been included on the list, which was complied from a data-driven survey of more than 5,000 companies whose annual revenues exceeded $500 million.
Applied Materials Executive Chairman Mike Splinter was recognized this week at the Semiconductor Industry Association’s (SIA) 36th annual awards dinner, where he received the Robert N. Noyce Award, the industry’s highest honor, for his significant contributions to the U.S. semiconductor industry in technology and public policy.
A well-known and respected industry veteran, Mike successfully led Applied Materials as CEO for more than a decade, expanding the company’s position as a leading global equipment provider to the semiconductor, display and solar industries, and helping to drive critical innovations in transistor design to further Moore’s Law, the foundation of all...
What’s the population of Singapore? How many species of salmon are there in the world? Who won the gold medal for men’s downhill skiing in the 1994 Olympic Winter Games? Answers to these questions along with an infinite amount of other information are now easily available to a majority of the world’s fingertips thanks to something that happened 44 years ago today. That’s when two computers, one at UCLA and one at the Stanford Research Institute, connected over ARPANET (Advanced Research Projects Agency Network) to exchange the world’s first “host-to-host” message. This rather inauspicious event is viewed by many as the birth of a technology that became a communication tool now used by billions of people around the world every day. Of course, I’m talking about the Internet.
Applied Materials Executive Chairman Mike Splinter was interviewed by Liz Claman earlier this week as part of FOX Business’ “Three Days in the Valley” series. Mike explained how materials innovations are key to enabling the low power, high performance chips used in cutting-edge mobile products such as wearables and smartphones like those launched recently by Samsung and Apple.
The past several weeks have been big for 3D NAND flash technology.
Samsung announced it had begun mass production of its first 3D vertical NAND flash memory, a 128GB chip using 24 cell layers. Following this news, at the Flash Memory Summit, Samsung Executive Vice President and General Manager E.S. Jung delivered a special keynote address, titled ”Ushering in the 3D Memory Era with Vertical NAND.” In his talk, he told the audience that Samsung’s implementation of 3D NAND was delivering impressive performance benefits over its previous 19nm planar NAND: 2 times higher density, 2 times faster write speed, 50 percent less power consumption and 10 times better endurance.
This year marks the 40th anniversary of the first cell phone call, and one would be hard pressed to think of a more ubiquitous high tech device. Market research firm mobiThinking puts the total number of worldwide cell phone subscribers in 2012 at more than 6.8 billion. That’s equivalent to about 96 percent of the world’s population!
How did the cell phone become the most widely used communication technology in human history? A major factor is the ongoing advancement of high-performance, low-power semiconductor components. These advancements improve battery life and enable the continuous addition of new features and functionality that make today’s smartphones a reality. Taking this one step further, the advancements in semiconductor technology are largely the result of work by thousands of engineers and scientists to push the limits of the physical and material sciences.