Moore's Law

Designing “Eyes” into Process Equipment to Improve Chip Performance and Yield

Metrology allows process engineers to see the results of process steps. Today, driving improvements in chip performance, power and area/cost (PPAC) requires novel architectures and exotic material stacks. This is introducing new sources of atomic-scale variation that can negatively impact chip performance and yield. It is becoming imperative to “watch” the deposition process as it occurs to control variability and deliver repeatable performance.

Beyond Von Neumann: Applied Materials and Arm Lead DARPA-Funded Research on a Neuromorphic Switch for AI

Back in July, Applied Materials announced that we’d been selected by the Defense Advanced Research Projects Agency (DARPA) to develop technology for AI. At the core of this project are the efforts of Applied Materials, Arm and Symetrix to develop a correlated electron switch. This of course begs the question, “what the heck is a correlated electron?”