memory

Happy 24th Anniversary, Endura!

Happy 24th Anniversary, Endura!

The Endura® system is recognized as the most successful metallization tool in the history of the semiconductor industry. Since its introduction, through continuous infusions of new innovations and process technologies, it has enabled customers to advance Moore’s Law from the .75 micron node to today’s sub-20 nanometer nodes, and can continue beyond to sub-10 nanometer designs.To appreciate what made the Endura a truly landmark system, and how the value it provides has been sustained over decades, I'd like to reference the recent VLSIresearch feature and highlight some key points.
The Shift to Materials-Enabled 3D

The Shift to Materials-Enabled 3D

Every year, media outlets publish year-end reviews and outlooks for the New Year. Solid State Technology, a leading magazine providing the latest electronics manufacturing news, analysis and product information related to semiconductor manufacturing features an annual outlook and invited Randhir Thakur, Executive Vice President, General Manager, Silicon Systems Group, Applied Materials to give his assessment of the major trends for 2014. He identified the shifts to 20 nanometer designs, FinFET transistors and 3D NAND as the game-changing innovations and discussed how Applied is focused on providing the precision materials engineering solutions to address the challenges involved in advancing these technologies.
Applied Materials

What is Going on with Sub-20nm Flash?

This week I’ll be participating in a panel discussion at the Flash Memory Summit in Santa Clara, CA. The panel’s topic, Flash Below 20nm: What is Coming and When?, couldn’t be more timely. Particularly in light of a leading NAND manufacturer’s recent announcement that they will begin mass production of the semiconductor industry’s first 3D vertical NAND flash memory later this year.3D NAND presents some significant changes to the traditional semiconductor manufacturing model.