lithography

New Lithography Technologies Gain a Foothold

New Lithography Technologies Gain a Foothold

Historically, many of the developments in the semiconductor industry have stemmed from the continued progress in lithography. However, with the persistent uncertainty of extreme ultraviolet (EUV) for future-generation patterning, the industry has developed techniques such as self-alignment double patterning (SADP) to extend optical lithography. In a video produced by SPIETV, Chris Bencher of Applied Materials Office of the Chief Technology Officer, reviews the evolution of SADP and looks to its future. 
Applied Explains: Photomask Technology for the EUV Era

Applied Explains: Photomask Technology for the EUV Era

Photomasks, as regular readers of this blog may recall, are the blueprints used for making chips. The photolithography process prints the patterns etched on the mask onto silicon wafers to define transistors, memory cells and wiring – all the nanoscale structures that make up a functional device.Lithography is expected to undergo a seismic shift over the next few years as the industry adopts a new technology called extreme ultraviolet lithography, or EUV for short. This change requires a new generation of photomasks featuring new materials and operating principles.
Lithography Celebrates 25 Years on the Cutting Edge

Lithography Celebrates 25 Years on the Cutting Edge

Applied Materials recently hosted a panel discussion with several distinguished semiconductor industry speakers as part of the SPIE Advanced Lithography conference earlier this month, which I had the honor of moderating. The panel discussion, a retrospective look at the 25 years of technology developments in metrology, inspection and process control was co-hosted by Chris Raymond, technology director at Nanometrics, Inc. and Chair of the SPIE Conference.