Applied Materials will host a forum at the IITC* conference in Grenoble, France on May 19 to discuss ways of overcoming critical challenges in copper interconnect scaling. While much of the industry’s focus has been on transistor scaling, at the 10nm node and beyond, the interconnect is becoming a major issue. Applied Materials and guest speakers will explore the path that interconnect technology must take to keep pace with Moore’s Law in a panel titled "Advancing the Frontiers of Interconnect Scaling."
Applied Materials introduces the biggest materials change in interconnect technology in 15 years with the announcement of the new Endura® Volta™ CVD system. Its unique cobalt processes ease critical interconnect scaling bottlenecks to enable continued momentum of Moore’s Law.
Chip makers and equipment suppliers are taking new steps forward in exploring revolutionary materials and techniques needed to continue enabling breakthroughs in microchip performance. The pace of innovation is ramping at a rate never-before experienced in the industry. We’re going to see more changes in the next five years than we’ve seen in last 15. Without these efforts, the innovation engine that has produced generation after generation of mobility and computing devices capable of astonishing capabilities will stall. One area where disruptive change is coming is the interconnect.
Following is a short explanation of this transition.
Applied Materials’ Bob Linke, process integration manager, Semitool Business Unit, discusses the Applied Raider GT electrochemical deposition (ECD) system – a significant innovation for fabricating copper interconnects at the 22nm technology node and beyond.