AI is one of the most exciting and most pervasive inflections to happen in our lifetime. But it is challenging the entire design ecosystem – from materials to systems – in a way that we haven’t experienced before.
My previous blog explained the computing architecture requirements for AI workloads. Now, I take a deep dive into the types of materials engineering breakthroughs needed to enable these new architectures.
Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.